Job Description:
1. Lead an engineering team （60 to 70 engineers） to perform process an d product
qualifications for Lead frame Type、PBGA packages
2. Work with Station & Manufactory  PE team to implement new processes an d products into production line
3. Work with customer to understand the customer requirements an d to implement
 them in the process
4. Take in charge of conducting process evaluations an d preparing reports including,
FMEA, DOE
（process windows）, failure analysis an d process specs. 5.  Take in charge of
engineering supports for Production sustaining.
5. Strong experience should be in the areas of Molding, laser scribing an d laser
marking for SiP packages.

Qualification:
【Education Background】
1.BS degree Ｏr above in related engineering majors
2.Excellent interpersonal an d communications skills in both Chinese & English

【Working Experiences】
1.10 to 15 year experience in electronic packaging, engineering an d manufacturing management.
2.Packaging back-end experiences are required, such as molding, laser marking / trimming / singulation, experience in SMT is a plus.
3.Experiences to work with English speaking customers.

【Requirements】
1.Project Management Skill,
2.communications skills in both Chinese & English
3.Strong multi-task skills an d detail oriented
4.Able to work under pressure an d complex environment