Job Description: 1. Lead an engineering team (60 to 70 engineers) to perform process an d product qualifications for Lead frame Type、PBGA packages 2. Work with Station & Manufactory PE team to implement new processes an d products into production line 3. Work with customer to understand the customer requirements an d to implement them in the process 4. Take in charge of conducting process evaluations an d preparing reports including, FMEA, DOE (process windows), failure analysis an d process specs. 5. Take in charge of engineering supports for Production sustaining. 5. Strong experience should be in the areas of Molding, laser scribing an d laser marking for SiP packages.
Qualification: 【Education Background】 1.BS degree Or above in related engineering majors 2.Excellent interpersonal an d communications skills in both Chinese & English
【Working Experiences】 1.10 to 15 year experience in electronic packaging, engineering an d manufacturing management. 2.Packaging back-end experiences are required, such as molding, laser marking / trimming / singulation, experience in SMT is a plus. 3.Experiences to work with English speaking customers.
【Requirements】 1.Project Management Skill, 2.communications skills in both Chinese & English 3.Strong multi-task skills an d detail oriented 4.Able to work under pressure an d complex environment